Supplier: Shenzhen Minteda Electronics Co., Ltd
Contact person: Ms. Betty Li
Position:
Address: 8th Floor, Building 1, Honghui Industrial Park, Liuxian 2nd Road, Baoan District, Shenzhen
Country: China
Phone: - Mobi: 86-755 29106344
Artificial Intelligence PCBA
Price:
Artificial Intelligence PCBA
Product Description
Artificial intelligence technology involves the Internet of Things, cloud computing, big data, edge computing and other content. The research direction including learning machine, natural language processing, knowledge representation, automatic reasoning, computer vision and robot vision. The main application areas are mainly focused on education, medical, driverless, e-commerce retail, finance, personal assistant, campus, home, showroom and other vertical areas in a number of scenarios. Artificial intelligence on the motherboard's high requirements are mainly reflected in: strong performance of the processor, ultra-high arithmetic support, super display performance, support for ultra-high definition output, ultra-high scalability and rich network support.
As a PCBA production and design company with more than 20 years of experience in SMT assembly production, Minteda has international advanced production and testing equipment to meet your requirements. In the field of artificial intelligence, we provide you with the following types of artificial intelligence motherboard products, from small batch prototyping to mass production, including PCB design, PCBA mounting and DIP packaging services.
Process Capability
Solder paste printer printing accuracy: ±0.02mm
Printing repeat positioning accuracy: ±0.0125mm
Equipment reject material rate: within 5 parts per million
Mounting component size: CHIP 01005 (imperial system) ~ 100*90*21mm IC
Mounting accuracy: ±0.035mm
Mounting Repeat positioning accuracy ±0.025mm
CPK≥1.0
SMT workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature.
With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board).
More details please click here
Product Description
Artificial intelligence technology involves the Internet of Things, cloud computing, big data, edge computing and other content. The research direction including learning machine, natural language processing, knowledge representation, automatic reasoning, computer vision and robot vision. The main application areas are mainly focused on education, medical, driverless, e-commerce retail, finance, personal assistant, campus, home, showroom and other vertical areas in a number of scenarios. Artificial intelligence on the motherboard's high requirements are mainly reflected in: strong performance of the processor, ultra-high arithmetic support, super display performance, support for ultra-high definition output, ultra-high scalability and rich network support.
As a PCBA production and design company with more than 20 years of experience in SMT assembly production, Minteda has international advanced production and testing equipment to meet your requirements. In the field of artificial intelligence, we provide you with the following types of artificial intelligence motherboard products, from small batch prototyping to mass production, including PCB design, PCBA mounting and DIP packaging services.
Process Capability
Solder paste printer printing accuracy: ±0.02mm
Printing repeat positioning accuracy: ±0.0125mm
Equipment reject material rate: within 5 parts per million
Mounting component size: CHIP 01005 (imperial system) ~ 100*90*21mm IC
Mounting accuracy: ±0.035mm
Mounting Repeat positioning accuracy ±0.025mm
CPK≥1.0
SMT workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature.
With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board).
More details please click here
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